Adapter for a memory card and a memory card

ABSTRACT

An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese patent applicationNo. 2005-053684 filed on Feb. 28, 2005, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a technique on an adapter for a memorycard and a memory card. Particularly, the present invention is concernedwith a technique applicable effectively to an adapter for a memory cardstill smaller than a small-sized memory card such as a reduced-size MMC,as well as the memory card.

Such memory cards as a multi-media card (there is a standard establishedby Multi-Media Card Association; hereinafter referred to as MMC) and anSD card (there is a standard established by SD Card Association) are oneof storage devices which store information in a semiconductor memorychip disposed in the interior thereof. In the memory cards in question,an access of information is made directly and electrically to anon-volatile memory formed in the semiconductor memory chip and thusthere is no control of a mechanical system, so that the memory cards inquestion have such excellent characteristics as the read time being highand the replacement of a storage medium being easy in comparison withother storage devices. Besides, since the outline is relativelysmall-sized and light-weight, the memory cards in question are usedmainly as auxiliary storage devices in devices required to be portablesuch as portable personal computers, portable telephones and digitalcameras.

An MMC is a small-sized and light-weight memory card having a weight of1.5 g, outline dimensions of 32 mm×24 mm and a thickness of 1.4 mm. Itis provided with a thin plate-like cap of a generally quadrangular shapein plan having a largely chamfered corner portion and is also providedwith a memory body fitted in a recess formed in a parts-accommodatingsurface. The memory body includes a wiring substrate, a semiconductorchip mounted on a main surface of the wiring substrate, and a resinsealing member for sealing the semiconductor chip. The semiconductorchip is electrically connected through wiring lines formed on the wiringsubstrate to plural external terminals formed on a back surface of thewiring substrate. The plural external terminals are exposed to theexterior and are connected electrically to an electronic device in whichthe MMC is incorporated.

A reduced-size MMC (Reduced Size MMC, hereinafter referred to as RSMMC)is a memory card (weight 0.8 g, outline dimensions 18 mm×24 mm,thickness 1.4 mm) of a size about half the size of the above MMC. Anexternal terminal structure of the RSMMC has compatibility with the MMCand can be used as an MMC by using an adapter for a memory card.

Further, the above SD card is a memory card having a weight of 3 g,outline dimensions of 32 mm×24 mm and a thickness of 2.1 mm. It is thesame in shape as the MMC though different in weight and thickness. TheSD card is provided with two thin plate-like cases of a quadrangularshape in plan having a largely chamfered corner portion and is alsoprovided with a memory body sandwiched in between the two cases. Pluralapertures are formed in a back surface of one case in the SD card,plural external terminals formed on a back surface of the memory bodyare exposed from the apertures, and the external terminals of the SDcard and an electronic device in which the SD card is incorporated areelectrically connected with each other through the apertures. Theforegoing MMC is also employable in most of electronic devices insofaras the electronic devices are configured so as to permit the use of theSD card.

As to the adapter for a memory card, a related description is found, forexample, in Japanese Unexamined Patent Publication No. 2004-348557(Patent Literature 1), in which there is disclosed a configuration of anadapter for converting such a small-sized memory card as RSMMC into anordinary MMC size.

Further, for example in Japanese Unexamined Patent Publication No.2004-133516 (Patent Literature 2) there is disclosed a configurationwherein a sealing portion which covers an IC body is provided in theexterior of such a memory card as MMC and the IC body is held firmlywhile being sandwiched in between a memory card case and the sealingportion.

[Patent Literature 1]

Japanese Unexamined Patent Publication No. 2004-348557

[Patent Literature 2]

Japanese Unexamined Patent Publication No. 2004-133516

SUMMARY OF THE INVENTION

Recently, with the reduction in size of electronic devices incorporatedinto memory cards, an extremely small-sized memory card somewhat thinnerthan the foregoing MMC and SD card and smaller in planar size than theRSMMC has been being commercialized. In this case, it is an importantsubject in what manner such an extremely small-sized memory card is tobe made employable in a corresponding larger-size device such as MMC, SDcard or RSMMC.

It is an object of the present invention to provide a technique whichcan improve the versatility of an extremely small-sized memory card.

The above and other objects and novel features of the present inventionwill become apparent from the following description and the accompanyingdrawings.

The following is an outline of typical modes of the present invention asdisclosed herein.

In one aspect of the present invention there is provided an adapter fora memory card, the adapter having the same planar size as that of amemory card of a first size and having a space capable of receivingtherein a memory card of a second size smaller than the first size,wherein the thickness of a region within the space of the adapter whereinternal terminals are disposed is made larger than that of a region ofthe adapter where plural external terminals are disposed.

In another aspect of the present invention there is provided a memorycard comprising a semiconductor chip mounted on a first surface of awiring substrate and having a memory circuit which contributes to thestorage of information, an electronic part mounted on a second surfaceon the side opposite to the first surface of the wiring substrate, and aplurality of external terminals disposed on the second surface of thewiring substrate at a position spaced away from the electronic part andconnected electrically to both the semiconductor chip and the electronicpart, wherein the thickness of a region of the memory card where theelectronic part is mounted is made larger than that of a region of thememory card where the plural external terminals are disposed.

The following is a brief description of effects obtained by the typicalmodes of the present invention as disclosed herein.

Since the adapter for a memory card has the same planar size as that ofa memory card of a first size and has a space able to receive therein amemory card of a second size smaller than the first size and thethickness of a region within the space of the adapter where internalterminals are disposed is made larger than that of a region of theadapter where plural external terminals are disposed, a memory card ofan extremely small size can be changed to a memory card of a larger sizeand therefore it is possible to improve the versatility of the extremelysmall-sized memory card.

Since the thickness of the electronic part mounted region of the memorycard is made larger than that of the external terminals-disposed regionof the memory card, it is possible to improve the performance of thememory card.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an entire perspective view of an adapter for a memory cardaccording to an embodiment of the present invention as seen from anupper surface side;

FIG. 2 is an entire perspective view of the adapter of FIG. 1 as seenfrom a back surface side;

FIG. 3 is an entire plan view of the upper surface of the adapter;

FIG. 4 is an entire plan view of the back surface of the adapter;

FIG. 5 is a front view of the adapter as seen in the direction of arrowA in FIG. 3;

FIG. 6 is a side view of the adapter as seen in the direction of arrow Bin FIG. 3;

FIG. 7 is a rear view of the adapter as seen in the direction of arrow Cin FIG. 3;

FIG. 8 is an entire perspective view of the adapter as seen from theupper surface (first surface) side in a state in which a memory card ofan extremely small size is being loaded into the adapter;

FIG. 9 is an entire perspective view of the adapter as seen from theback surface (second surface) side after loading of the extremelysmall-sized memory card;

FIG. 10 is an entire plan view of an upper surface of the extremelysmall-sized memory card shown in FIG. 8;

FIG. 11 is an entire plan view of a back surface of the extremelysmall-sized memory card shown in FIG. 10;

FIG. 12 is a front view of the extremely small-sized memory card as seenin the direction of arrow A in FIG. 10;

FIG. 13 is a side view of the extremely small-sized memory card as seenin the direction of arrow B in FIG. 10;

FIG. 14 is a rear view of the extremely small-sized memory card as seenin the direction of arrow C in FIG. 10;

FIG. 15 is an entire plan view of the upper surface of the adapter afterloading of the extremely small-sized memory card;

FIG. 16 is an entire plan view of the back surface of the adapter afterloading of the extremely small-sized memory card;

FIG. 17 is a sectional view taken on line X1-X1 in FIG. 15;

FIG. 18 is an explanatory diagram of dimensions in the thicknessdirection of the adapter;

FIG. 19 is an entire plan view of the back surface of the adapter shownin FIG. 1;

FIG. 20 is an entire plan view showing an example of an inserted stateof the adapter of FIG. 1 into a socket of an electronic device;

FIG. 21 is a side view of the adapter shown in FIG. 20;

FIG. 22 is an entire plan view of a back surface of an adapter for amemory card according to another embodiment of the present invention;

FIG. 23 is an explanatory diagram of a test work performed in a state inwhich a memory card is incorporated into the adapter of FIG. 22;

FIG. 24 is a side view of the adapter shown in FIG. 23;

FIG. 25 is an entire perspective view of an adapter for a memory cardaccording to a further embodiment of the present invention as seen froma back surface side;

FIG. 26 is an entire perspective view of the adapter of FIG. 25 as seenfrom a rear side;

FIG. 27 is an entire perspective view of an adapter for a memory cardaccording to a still further embodiment of the present invention as seenfrom a back surface side;

FIG. 28 is an entire perspective view of an adapter for a memory card asseen from a back surface side which adapter is a modification of theadapter of FIG. 27;

FIG. 29 is an entire perspective view of an adapter for a memory cardaccording to a still further embodiment of the present invention as seenfrom an upper surface side;

FIG. 30 is an entire perspective view of the adapter of FIG. 29 as seenfrom the upper surface side after loading of a memory card thereto;

FIG. 31 is a rear view thereof;

FIG. 32 is a sectional view taken on line X2-X2 in FIG. 30;

FIG. 33 is an entire perspective view of a memory card according to astill further embodiment of the present invention as seen from a backsurface side;

FIG. 34 is an entire perspective view of an adapter for a memory card asseen from a back side of which adapter is a modification of the adapterof FIG. 33;

FIG. 35 is a side view on a memory card insertion side of the adaptersof FIGS. 33 and 34;

FIG. 36 is a side view on a memory card insertion side of the adaptersaccording to a modification of FIG. 35;

FIG. 37 is an entire perspective view of an adapter for a memory card asseen from an upper surface side which adapter is a modification of theadapters of FIGS. 33 and 34;

FIG. 38 is an entire perspective view of an adapter for a memory card asseen from an upper surface side according to a still further embodimentof the present invention;

FIG. 39 is an entire perspective view of an adapter for a memory card asseen from an upper surface side of which adapter is a modification ofthe adapter of FIG. 38;

FIG. 40 is an entire plan view of an upper surface of an adapter for amemory card according to a still further embodiment of the presentinvention;

FIG. 41 is an entire plan view of a back surface thereof;

FIG. 42 is a front view of the adapter as seen in the direction of arrowA in FIG. 40;

FIG. 43 is a side view of the adapter as seen in the direction of arrowB in FIG. 40;

FIG. 44 is a rear view of the adapter as seen in the direction of arrowC in FIG. 40;

FIG. 45 is an entire plan view of the upper surface of the adapter afterloading thereto a memory card of an extremely small size;

FIG. 46 is an entire plan view of the back surface of the adapter afterloading thereto the extremely small-sized memory card;

FIG. 47 is a sectional view taken on line X3-X3 in FIG. 45;

FIG. 48 is a plan view of the adapter, showing an example of layout ofconnector wiring within the adapter;

FIG. 49 is an entire perspective view of an adapter for a memory card asseen from an upper side according to a still further embodiment of thepresent invention;

FIG. 50 is an entire perspective view of the adapter of FIG. 49 as seenfrom the upper surface side after loading of a memory card thereto;

FIG. 51 is a sectional view of a memory card according to a stillfurther embodiment of the present invention as cut in parallel with aside face thereof;

FIG. 52 is a sectional view of the memory card of FIG. 51 as cut inparallel with a rear face thereof;

FIG. 53 is a sectional view of a memory card according to a stillfurther embodiment of the present invention as cut in parallel with aside face thereof;

FIG. 54 is a sectional view of the memory card of FIG. 53 as cut inparallel with a rear face thereof;

FIG. 55 is a sectional view of a memory card according to a stillfurther embodiment of the present invention as cut in parallel with aside face thereof;

FIG. 56 is an enlarged sectional view of a principal part of a secondportion on a back surface side of the memory card of FIG. 55; and

FIG. 57 is a sectional view of a memory card according to a stillfurther embodiment of the present invention as cut in parallel with aside face thereof.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Where required for convenience's sake, the following embodiments willeach be described in a divided manner into plural sections ofembodiments, but unless otherwise mentioned, they are not unrelated toeach other, but are in a relation such that one is a modification or adetailed or supplementary explanation of part or the whole of the other.In the following embodiments, when reference is made to the number ofelements (including the number, numerical value, quantity and range), nolimitation is made to the number referred to, but numerals above andbelow the number referred to will do as well unless otherwise mentionedand except the case where it is basically evident that limitation ismade to the number referred to. Further, it goes without saying that inthe following embodiments their constituent elements (includingconstituent steps) are not always essential unless otherwise mentionedor in the case where they are considered obviously essential inprinciple. Likewise, it is to be understood that when reference is madeto the shapes and positional relation of constituent elements in thefollowing embodiments, those closely similar to or resembling suchshapes, etc. are also included unless otherwise mentioned or in the casewhere a negative answer obviously results in principle. This is alsotrue of the foregoing numerical value and range. Moreover, in all of thedrawings for illustrating the following embodiments, portions having thesame functions are identified by like reference numerals, and repeatedexplanations thereof will be omitted if possible. Embodiments of thepresent invention will be described in detail hereinunder with referenceto the accompanying drawings.

First Embodiment

FIG. 1 is an entire perspective view of an adapter for a memory cardaccording to a first embodiment of the present invention as seen from anupper surface (first surface) side, FIG. 2 is an entire perspective viewof the adapter of FIG. 1 as seen from a back surface (second surface)side, FIG. 3 is an entire plan view of the upper surface of the adapterof FIG. 1, FIG. 4 is an entire plan view of the back surface of theadapter of FIG. 1, FIG. 5 is a front view of the adapter as seen in thedirection of arrow A in FIG. 3, FIG. 6 is a side view of the adapter asseen in the direction of arrow B in FIG. 3, and FIG. 7 is a rear view ofthe adapter as seen in the direction of arrow C in FIG. 3.

An adapter for a memory card, (hereinafter referred to simply as“adapter”), 1A according to a first embodiment of the present inventionis constituted, for example, by a small thin plate of a rectangularplanar shape having a large chamfered portion CA1 for index formed atone corner, for example. The adapter 1A has the same planar size(standardized) as that of a full-size MMC (a memory card of a first sizeor IC (Integrated Circuit) card), e.g., 24 mm in width W1 and 32 mm inlength L1. The adapter 1A has a card receiving space able to receivetherein a memory card (a memory card of a second size or IC card) of anextremely small size to be described later which is smaller than theMMC. Illustrated is one which functions as an adapter for HS (HighSpeed) MMC. When the extremely small-sized memory card is received intothe card receiving space of the adapter 1A, it becomes possible to usethe adapter 1A as an auxiliary storage device of MMC size in any ofvarious portable electronic devices, including information processorssuch as portable computers, image processors such as digital cameras,and communication devices such as portable telephones.

The size (standardized) of the thickness of the adapter 1A according tothe first embodiment is different from the standard of MMC and theadapter 1A has a first portion which is relatively thin and a secondportion which is relatively thick. The first portion which is relativelythin has a thickness D1 of, say, 1.4 mm equal to the ordinary thicknesssize (standardized) of MMC.

In the first portion which is relatively thin, a terminal region andguide rail regions GR are disposed on a back surface of the adapter 1A.In the terminal region, for example, thirteen external terminals (firstexternal terminals) 2 are arranged in two rows in the longitudinaldirection of the adapter 1A (in the longitudinal direction of theextremely small-sized memory card or in a direction of insertion of thesame memory card into the adapter 1A) in an exposed state to theexterior.

The guide rail regions GR are regions retreated inwards by a length L2(e.g., 0.8 mm or more) from side ends of the adapter 1A andcorresponding to guide rail regions of MMC. That is, when installing theadapter 1A which incorporates the memory card into any of the foregoingelectronic devices, guide rails for the memory card provided on theelectronic device side are combined with the guide rail regions GR ofthe adapter 1A. If the guide rail regions GR of the adapter 1A arethick, it becomes impossible to install the adapter 1A whichincorporates the memory card into the electronic device. Therefore, theguide rail regions GR are formed in the first portion which isrelatively thin.

On the other hand, in the second portion relatively thicker than thefirst portion, there is formed a protuberant portion H somewhatprotruding in a direction away from the back surface of the adapter 1A.The thickness D2 of the second portion which is relatively thick is setat, say, about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm). The protuberantportion H in the second portion which is relatively thick is formed insuch a manner that an outer periphery thereof is spaced by a length ofL3 away from an outer periphery of the external terminals 2. The lengthL3 is set to at least, say, 0.8 mm or more, preferably 1.0 mm or so,taking an overstroke into account when taking out the adapter with thememory card incorporated therein from the electronic device by apush-push method. That is, in the adapter 1A of this first embodiment,the protuberant portion H in the second portion which is relativelythick is formed up to a rear face of the adapter 1A from the positionspaced by the length L3 from the outer periphery of the externalterminals 2. In the illustrated example, the protuberant portion H inthe second portion which is relatively thick is present not only behind(toward the rear face of the adapter 1A) the external terminals 2arranged in the second row (rear row) from a front face side of theadapter 1A but also between the adjacent innermost external terminals 2in the aforesaid second row (rear row).

In the rear face of the adapter 1A is formed an opening (first opening)3 for inserting the extremely small-sized memory card from the exteriorinto the card receiving space formed in the interior of the adapter 1Aand for taking out the memory card from the card receiving space to theexterior. The opening 3 is formed by a slot (recess) formed in the rearface of the adapter 1A. The opening 3 has a rectangular plane shape andhas a width W2 of, say, about 10 to 15 mm which is larger than the widthof the extremely small-sized memory card and smaller than the width W1of the adapter 1A. Further, the opening 3 has a height D3 of, say, about1.0 to 1.5 mm which is larger than the thickness of the extremelysmall-sized memory card and smaller than the thickness D2 of the adapter1A. That is, the thickness D2 of the second portion of the adapter 1A islarger than the thickness D1 of the first portion. As will be describedin detail later, the adapter 1A is formed so that the thickness of itssecond portion is such a thickness D2 as to cover the sum of thethickness of the memory card 5 and the height of connector lines 10,whereby a space for the memory card indicated at 5 and the connectorlines 10 can be ensured within the adapter 1A.

FIG. 8 is an entire perspective view of the adapter as seen from theupper surface (first surface) side in a state in which the extremelysmall-sized memory card is being loaded into the adapter, FIG. 9 is anentire perspective view of the adapter as seen from the back surface(second surface) side after loading of the extremely small-sized memorycard, FIG. 10 is an entire plan view of an upper surface of theextremely small-sized memory card shown in FIG. 8, FIG. 11 is an entireplan view of a back surface of the extremely small-sized memory cardshown in FIG. 10, FIG. 12 is a front view of the extremely small-sizedmemory card as seen in the direction of arrow A in FIG. 10, FIG. 13 is aside view of the extremely small-sized memory card as seen in thedirection of arrow B in FIG. 10, and FIG. 14 is a rear view of theextremely small-sized memory card as seen in the direction of arrow C inFIG. 10.

As shown in FIGS. 8 and 9, the extremely small-sized memory card 5 isreceived in the card receiving space of the adapter 1A through theopening 3 formed in the rear face of the adapter in a state in whichplural external terminals 6 face the same direction as the pluralexternal terminals of the adapter. The memory card 5 is smaller inoutline size than the so-called RSMMC. For example, the memory card 5has a width W3 of 11 mm, a length L4 of 14 mm which is shorter than halfof the length L1 in the longitudinal direction of the adapter 1A, and athickness D4 of about 1.0 to 1.2 mm. On a front-side back surface of thememory card 5 are formed, say, eleven external terminals (secondexternal terminals) 6 in one row in an exposed state to the exterior.

FIG. 15 is an entire plan view of the upper surface of the adapter afterloading of the extremely small-sized memory card, FIG. 16 is an entireplan view of the back surface of the adapter after loading of theextremely small-sized memory card, and FIG. 17 is a sectional view takenon line X1-X1 in FIG. 15. In FIGS. 15 and 16, the memory card 5 presentwithin the adapter 1A is shown in a see-through state. Broken linesshown in FIGS. 15 and 16 each represent the center in the longitudinaldirection of the adapter 1A (in the longitudinal direction of the memorycard 5, i.e., in the direction of insertion of the memory card 5 intothe adapter 1A).

The adapter 1A includes a first case (first housing) 8 a on the uppersurface side of the adapter 1A and a second case (second housing) 8 b onthe back side of the adapter. The first case 8 a has an upper surface(first surface) and a back surface (second surface) which are positionedon mutually opposite sides in the thickness direction of the adapter 1A.On the back surface of the first case 8 a, not only the plural externalterminals 2 are disposed, but also the second case 8 b is joined to theback surface by a thermosonic wire bonding method for example.

As shown in FIG. 17, the portion of the first case 8 a alone in theadapter 1A is the first portion as a relatively thin portion having thethickness D1, while the joined portion between the first and secondcases 8 a, 8 b is the second portion as a relatively thick portionhaving the thickness D2. That is, the second case 8 b forms theprojecting portion H. Concave portions 8 a 1 and 8 b 1 formedrespectively in opposed surfaces of the first and second cases 8 a, 8 boverlap each other in the joined portion between the first and secondcases, whereby the card receiving space 9 is formed. The card receivingspace 9 is positioned centrally in the width direction (transversedirection) of the adapter 1A. That is, vacant regions are present rightand left of the card receiving space 9.

From the standpoint of, for example, attaining the reduction of weight,easiness of machining and flexibility, the first and second cases 8 a, 8b are formed of a thermoplastic resin such as, for example,polycarbonate, ABS (acrylonitrile butadiene styrene resin, PBT(polybutylene terephthalate, PPE (polyphenylene ether), nylon, LCP(liquid crystal polymer), PET (polyethylene terephthalate), or a mixturethereof. The first and second cases 8 a, 8 b may each be formed byplural blocks. In this case, all of the plural blocks may be formed ofresin, but a thin block portion may be formed of metal. By so doing itis possible to improve the mechanical strength of the thin adapter 1A.

Each of the external terminals 2 is connected electrically to one end ofthe associated connector line (wiring line) 10. Opposite ends of theconnector lines 10 extend into the card receiving space 9 and areelectrically connected to internal terminals 10 a which are integrallyformed at extending ends of the connector lines 10. The internalterminals 10 a are disposed within the card receiving space 9 so as tobecome electrically connected to the external terminals 6 of the memorycard 5 upon insertion of the memory card into the card receiving space9. The connections between the connector lines 10 and the internalterminals 10 a are formed in a curved shape so as to operate as platesprings. With the curved connections, when the memory card 5 is insertedinto the card receiving space 9, the internal terminals 10 a are urgedtoward the external terminals 6 of the memory card 5, press the externalterminals 6 and come into contact firmly with the external terminals 6.

FIG. 18 is an explanatory diagram of dimensions in the thicknessdirection of the adapter 1A.

The present inventors have studied fabrication of an adapter whichpermits a change in size of the extremely small-sized memory card 5 intothe MMC size. As described above, the thickness of MMC is 1.4 mm, whilethat of the memory card 5 is about 1.0 to 1.2 mm, therefore, it followsthat there remains only about 0.2 to 0.4 mm as the difference betweenboth thicknesses. Assuming that the adapter is required to have a casethickness of at least 0.1 mm, the total thickness of upper and lowercases in the adapter thickness direction is 0.2 mm, thus giving rise tothe problem that a portion for disposing the internal terminals 10 acannot be ensured within the adapter.

In this first embodiment, therefore, the adapter 1A is formed with asecond portion thicker than the first portion whose thickness is equalto the thickness of MMC, as noted above. More specifically, in theadapter 1A, the thickness of at least the region where the internalterminals 10 a are disposed is made larger than the thickness of theregion where the plural external terminals 2 are disposed. As a result,a portion where the internal terminals 10 a are to be disposed can beensured within the adapter 10 a and hence it is possible to provide theadapter 1A which permits a change of the extremely small-sized memorycard 5 to MMC. That, since the extremely small-sized memory card 5 canbe changed to the larger MMC by inserting it into the adapter 1A, it ispossible to improve the versatility of the memory card 5.

If a projection height D5 of each internal terminal 10 a is, say, about0.1 mm and a height D6 necessary for constituting the plate spring ofeach connector line 10 is, say, about 0.2 to 0.3 mm, a height (thicknessof the second case 8 b or the height of the protuberant portion H) D7necessary for installation of the internal terminals 10 a is equal toheight D5+height D6 and is therefore, say, about 0.3 to 0.4 mm. Giventhat the thickness D8 of the first case 8 a is 0.1 mm, the thickness D2of the thick, second portion of the adapter 1A becomes equal to thethickness D4 (1.2 mm) of the extremely small-sized memory card 5+heightD7+thickness D8 and is, say, about 1.6 to 1.7 mm. Since the socket ofthe electronic device for insertion therein of MMC has such dimensionsas permit insertion therein of SD card (thickness 2.1 mm), an upperlimit of the thickness D2 of the thick, second portion in the adapter 1Ais, say, 2.1 mm. That is, the thickness D2 of the thick, second portionis, say, 1.6 to 2.1 mm. Or, the height (thickness of the second case 8 bor the height of the protuberant portion H) D7 necessary forinstallation of the internal terminals 10 a is, say, 0.3 to 0.7 mm.

Second Embodiment

FIG. 19 is an entire plan view of the back surface of the adapter of theprevious first embodiment, FIG. 20 is an entire plan view showing anexample of an inserted state of the memory card-incorporated adapterinto a socket of an electronic device, FIG. 21 is a side view of theadapter shown in FIG. 20, FIG. 22 is an entire plan view of a backsurface of an adapter according to a second embodiment of the presentinvention, FIG. 23 is a diagram showing a state in which a memory cardis being tested in an inserted condition thereof into the adapter shownin FIG. 22, and FIG. 24 is a side view showing an example in which theadapter of FIG. 22 with the memory card incorporated therein isinstalled into a socket of an electronic device.

The protuberant portion H described in the first embodiment has a convexshape in plan constituted by a front-side region RA and a rear-sideregion RB of the adapter 1A, as shown in FIG. 19. In this secondembodiment, reference will be made to a case where the projectingportion has a generally quadrangular shape in plan with the front-sideregion RA omitted.

FIGS. 20 and 21 illustrate an inserted state of the adapter 1A of FIG.19 into a socket of an electronic device. As shown in FIG. 20, terminals12 disposed within the socket of the electronic device extend from thefront to the rear side of the adapter 1A and come into contact withexternal terminals 2 of the adapter. FIG. 21 is a sectional view (sideview) of FIG. 20, illustrating an inserted state of the adapter 1A intothe socket of the electronic device. As shown in these figures, it isseen that the front region RA of the adapter 1A can be omitted.

FIG. 22 illustrates a case where the front side of the adapter 1A isomitted. As to a protuberant portion H, it is of the same structure asthat in the first embodiment with respect to the rear side of theadapter 1A and is present on only the rear side from the second row ofexternal terminals 2. That is, the protuberant portion H is not formedin the first and second rows of external terminals 2. According to thisstructure, since the shape of the protuberant portion H is simple, itbecomes possible to simplify the manufacturing process for the adapter1A.

The present inventors have made a study about a configuration whichpermits the execution of a test work without taking out the memory card5 from the adapter 1A in the event of malfunction of the memory card 5.In more particular terms, the present inventors have made a study aboutan adapter structure which permits the execution of a test work using anexisting test device for MMC in an inserted state of the memory cardinto the adapter 1A on the assumption that the test cannot be performedby the existing test device in case of a change of the memory card 5into an extremely small-sized one.

In FIG. 22, plural test terminals TEST are provided in a space formed byomission of the front-side region RA of the adapter 1A. The plural testterminals TEST are each formed at a position spaced a distance L3 fromthe first and second rows of external terminals 2 so as to avoid contactthereof with the external terminals 2. Thus, the test terminals TEST arespaced away from the external terminals lest they should contact theexternal terminals.

For distinction from the external terminals 12, each test terminal TESTis formed smaller in size than the external terminals 12 and is formedin a different shape from the shape of the external terminals. As to thelayout of the test terminals TEST, although in the illustrated examplethe test terminals TEST are arranged at equal intervals in both thedirection of insertion of the memory card 5 and a direction orthogonalto the card inserting direction, no limitation is made thereto. Forexample, they may be arranged in a zigzag fashion. In this case, itbecomes possible to arrange a larger number of test terminals TEST thanin the equally spaced layout. Further, although in the illustratedexample the test terminals TEST are formed in a circular shape, nolimitation is made thereto. For example, they may be formed in asemicircular, elliptic or polygonal shape.

The plural test terminals TEST are electrically connected (not shown) tothe memory card 5 present within the adapter 1A, so in the event acontroller chip mounted within the memory card 5 should becomeinoperable due to electrostatic breakdown for example, it is possible tomake a direct access control for a non-volatile memory chip from theexterior through the test terminals if there remain data in thenon-volatile memory chip. FIG. 23 shows a state in which a test is beingconducted by applying an existing test device to the test terminalsTEST. Although in the drawing a test probe is shown in a simplified formas the existing test device, no limitation is made thereto. Variousother existing test devices are employable.

Thus, in this embodiment the manufacturing process can be simplified byomitting the front-side region RA of the adapter 1A. Moreover, since theplural test terminals TEST are provided in the space formed by omissionof the front-side region RA, it is possible to conduct a test work forthe memory card 5 with use of an existing test device.

Third Embodiment

FIG. 25 is an entire perspective view of an adapter according to a thirdembodiment of the present invention as seen from a back surface side andFIG. 26 is an entire perspective view of the adapter as seen from a rearside.

In this third embodiment, guide portions 13 are formed along both innerside faces of an opening 3 and a card receiving space 9 in an adapter1C. The guide portions 13 extend from the opening 3 toward the cardreceiving space 9 and have not only a function of assisting a horizontalmovement of the memory card 5 at the time of inserting or taking out thememory card into or from the card receiving space but also a function ofpreventing insertion in an erroneous direction (reverse insertion) ofthe memory card 5. Other constructional points of the adapter 1C arecommon to the adapter 1A of the first embodiment. In this thirdembodiment, the opening 3 of the adapter 1C is formed in a polygonalshape in plan. In the example shown in FIGS. 25 and 26, the opening 3 isformed so as to have a region different in width in a directionorthogonal to the direction of insertion of the memory card 5. Morespecifically, the opening 3 is formed so that the width thereof on theback surface side of the adapter 1C is longer than that on the uppersurface side of the adapter.

According to this third embodiment, since the opening 3 has the abovestructure and the guide portions 13 are provided, it is possible toprevent reverse insertion of the memory card 5 and hence possible toprevent damage and deterioration of internal terminals 10 a andconnector lines 10 within the adapter 1C which are caused by the reverseinsertion.

Of course, the contents of this third embodiment may be combined withthe previous second embodiment. In this case, it is possible to obtainthe respective effects of both embodiments.

Fourth Embodiment

FIG. 27 is an entire perspective view of an adapter according to afourth embodiment of the present invention as seen from a back surfaceside and FIG. 28 is an entire perspective view of an adapter as seenfrom a back surface side which adapter is a modification of the adapterof FIG. 27.

In this fourth embodiment a description will be given about adapters 1Dand 1E for the ordinary MMC which is not for HSMMC. For example, sevenexternal terminals 2 are arranged in one row on a front back side ofeach of the adapters 1D and 1E. In the second portion which isrelatively thick, a protuberant portion H is formed over a rear face ofeach of the adapter 1D and 1E from a position which is spaced away bythe length L3 from a position corresponding to the second row in thecase of the external terminals 2 being arranged in two rows. Otherconstructional points are the same as those described above in the firstto third embodiments. FIG. 27 shows an example in which the guide rails13 are not formed, while FIG. 28 shows an example in which the guiderails 13 are formed. In the latter case it is possible to obtain thesame effects as in the third embodiment.

Fifth Embodiment

FIG. 29 is an entire perspective view of an adapter according to a fifthembodiment of the present invention as seen from an upper surface side,FIG. 30 is an entire perspective view of the adapter of FIG. 29 as seenfrom the upper surface side after loading of a memory card thereto, FIG.31 is a rear view of the adapter of FIG. 30, and FIG. 32 is a sectionalview taken on line X2-X2 in FIG. 30.

In this fifth embodiment, an opening (second opening) 15 extending fromthe opening 3 toward the card receiving space 9 is formed in an uppersurface of the adapter 1F. As in the first and second embodiments, theopening 15 is formed by a slot (recess) formed in an upper surface ofthe adapter 1F.

Guide portions 16 are provided at upper positions of both inner sidefaces of the opening 15. The guide portions 16 are formed along sidefaces of the slot which forms the opening 15 and are constituted byprotruding portions (convex portions) protruding from the side faces.The protruding portions are formed at positions closer to the uppersurface side of the adapter 1F rather than the bottom side of the slot.

The guide portions 16 have not only a function of assisting a horizontalmovement of the memory card 5 at the time of inserting or taking out thememory card into or from the card receiving space 9 and a function ofpreventing reverse insertion of the memory card 5 but also a function ofpressing the memory card 5 to prevent the card from moving out of thecard receiving space 9. In this case, as shown in FIG. 30, when thememory card 5 is received into the card receiving space 9 of the adapter1F, the upper surface of the memory card assumes an exposed state to theexterior.

The guide portions 16 extend continuously from the rear to the frontside of the adapter 1F. Also on side faces of the memory card 5 thereare formed guide portions 5 g as portions corresponding to the guideportions 16. Further formed on the side faces of the memory card 5 arestopper portions 5 s for stopping movement of the memory card 5 uponinsertion of the card into the adapter 1F. Other constructional pointsare the same as in the first to fourth embodiments. The guide portions 5g and the stopper portions 5 s are formed on side faces of the memorycard 5 and are constituted by protruding portions (convex portions)protruding from the side faces. The guide portions 5 g extend from thefront face (a face orthogonal to the direction of insertion of thememory card 5 into the adapter 1F) of the memory card 5 toward the rearface of the card. The protruding portions do not extend up to the rearface of the memory card 5 and thus the stopper portions 5 s are free ofthe protruding portions in the vicinity of the rear face of the memorycard 5.

With such a configuration of the memory card 5, as shown in FIG. 32, thememory card 5 can be disposed upward by an amount corresponding to anupper surface portion of a first case 8 a of the adapter 1F. That is, athickness corresponding to the thickness of the upper surface portion ofthe first case 8 a can be subtracted from the thickness of the memorycard 5, so that the thickness D2 of a relatively thick, second portionof the adapter 1F can be made smaller than in the first to fourthembodiments.

In the case of a configuration wherein only the rear side portion of thememory card 5 is exposed, there sometimes is a case where it isdifficult to take out the memory card 5 because of a small size of thememory card. On the other hand, in this fifth embodiment, the memorycard 5 can be taken out easily because the upper surface of the memorycard 5 received in the card receiving space 9 of the adapter 1F is alsoexposed to the exterior.

Sixth Embodiment

FIG. 33 is an entire perspective view of an adapter according to a sixthembodiment of the present invention as seen from a back surface sidethereof, FIG. 34 is an entire perspective view of an adapter as seenfrom a back surface side which adapter is a modification of the adapterof FIG. 33, FIG. 35 is a side view on a memory card insertion side ofthe adapters of FIGS. 33 and 34, FIG. 36 is a side view on a memory cardinsertion side of the adapters according to a modification of FIG. 35,and FIG. 37 is an entire perspective view of an adapter as seen from anupper surface side which adapter is a modification of the adapters ofFIGS. 33 and 34.

In this sixth embodiment, an opening 3 for inserting and taking out thememory card 5 into and from the card receiving space 9 is formed in aside face of each of adapters 1G and 1H.

In the case where an opening 3 is formed in a rear face of an adapter,the rear face of the adapter is exposed from a card take-out opening ofthe associated electronic device and the rear face of the memory card 5is also in an exposed state, so there is a fear that the memory card 5may be pulled out by mistake.

In this sixth embodiment, the opening 3 is formed in a side face of eachof the adapters 1G and 1H, so even if the rear face of each of theadapters 1G and 1H is exposed from the card take-out opening formed onthe associated electronic device side, there is no fear of the memorycard 5 being pulled out by mistake, because the rear face of the memorycard 5 is not exposed.

FIG. 33 shows an example of an adapter for HSMMC having thirteenexternal terminals and FIG. 34 shows an example of an adapter for theordinary MMC having seven external terminals 2. In FIGS. 33 and 34 thereis illustrated a memory card 5 in which, say, twenty external terminals6 are arranged in two rows. FIG. 35 shows an example an opening 3 freeof guide portions, while FIG. 36 shows an example of an opening 3 havingguide portions 13. The openings 3 are each formed by a slot (recess)formed in a side face of each of the adapters 1G and 1H. As to theadapter 1G, as shown in FIG. 35, its sectional and planar shapes are thesame as in the first embodiment. As to the adapter 1H, as shown in FIG.36, its sectional and planar shapes are the same as in the thirdembodiment. With the guide portions, it is possible to obtain the sameeffects as in the third embodiment. Further, FIG. 37 shows an example inwhich an opening 15 is formed in an upper surface of each of theadapters 1G and 1H as in the fifth embodiment. In this case, it ispossible to obtain the same effects as in the fifth embodiment.

Seventh Embodiment

FIG. 38 is an entire perspective view of an adapter according to aseventh embodiment of the present invention as seen from an uppersurface side and FIG. 39 is an entire perspective view of an adapter asseen from an upper surface side which adapter is a modification of theadapter of FIG. 38. In the drawings there is illustrated a memory card 5in which, say, twenty external terminals 6 are arranged in two rows.

In this seventh embodiment, an opening 3 for inserting and taking outthe memory card 5 into and from the card receiving space 9 is formed inan upper surface of each of adapters 1J and 1K. The opening 3 can beopened and closed with a lid 20. The lid 20 is formed of resin or metalfor example and is supported on the upper surface side of each of theadapters 1J and 1K in a state in which it can be opened and closed witha hinge portion.

In the adapter 1J of FIG. 38, a convex retaining portion 20 a isintegrally formed at an end of the lid 20. When the lid 20 is closed,the retaining portion 20 a is positioned on the rear side of the memorycard 5 present within the card receiving space 9 and functions toprevent the memory card 5 from falling out of the adapter 1J against thewill of the user. With the retaining portion 20 a, there is no fear ofoccurrence of such an inconvenience of the memory card 5 is pulled outby mistake from the interior of the adapter 1J. On a side face of a slotwhich constitutes the opening 3 of the adapter 1J there is formed aprotruding portion 3 a. The protruding portion 3 a is provided todetermine the position (height from the bottom of the slot whichconstitutes the opening 3) of the memory card 5 when the memory card isinserted into the opening 3. Therefore, the memory card 5 can be fixedstably upon insertion thereof. Although only one protruding portion 3 ais provided in the illustrated example, plural such protruding portions3 may be provided, whereby the memory card 5 can be fixed in a morestable manner.

A recess 8 b 2 is formed in the bottom of the slot which constitutes theopening 3. Upon insertion of the memory card 5, the recess 8 b 2 comesinto fitting engagement with the retaining portion 20 a of the lid 20,whereby the memory card 5 can be loaded stably to the adapter 1J.

The lid 20 has recesses (slots) 20 b formed in sides different from theside where the retaining portion 20 a is provided. Further, protrudingportions 3 b separate from the protruding portion 3 a are formed on sidefaces of the slot which constitutes the opening 3. The protrudingportions 3 b are each formed at a position closer to the surface of theadapter 1J with respect to the protruding portion 3 a. When the memorycard 5 is inserted into the adapter, the protruding portions 3 a and 3 bare fitted in the memory card, whereby the memory card can be loaded tothe adapter 1J in a more stable manner. Thus, since the retainingportion 20 a and the recesses 20 b are formed on different sides of thelid 20, there are obtained three support points upon insertion of thelid 20 into the adapter 1J. Consequently, the memory card 5 can beloaded in a much more stable manner than in the case of the retainingportion 20 a alone with only one support point. Although in theillustrated example the recesses 20 b and the protruding portions 3 bare each formed at two positions, it goes without saying that a morestable loading of the memory card can be effected by providing each ofthem in a larger number than two.

In the adapter 1K of FIG. 39, a retaining plate 21 is provided on therear side of the adapter 1K. A recess 21 a is formed centrally in thetransverse direction of the retaining plate 21. When the lid 20 isclosed, the retaining portion 20 a of the lid 20 is fitted in the recess21 a of the retaining plate 21 in a satisfactory manner. According tosuch a configuration, also in the case of the adapter 1K, there is nofear of occurrence of an inconvenience such that the memory card 5present within the adapter 1K is pulled out by mistake. Like the adapter1J, the adapter 1K is also provided with the protruding portions 3 a, 3b and recesses 20 b, whereby it is possible to obtain the same effectsas in the case of the adapter 1J described above.

Eighth Embodiment

FIG. 40 is an entire plan view of an upper surface of an adapteraccording to an eighth embodiment present invention, FIG. 41 is anentire plan view of a back surface of the adapter of FIG. 40, FIG. 42 isa front view of the adapter as seen in the direction of arrow A in FIG.40, FIG. 43 is a side view of the adapter as seen in the direction ofarrow B in FIG. 40, and FIG. 44 is a rear view of the adapter as seen inthe direction of arrow C in FIG. 40.

An adapter 1L according to this eighth embodiment has the same planarsize (standardized) as that of the so-called RSMMC (a memory card of thefirst size or IC card), e.g., 24 mm in width W1 and 18 mm in length L5and has a card receiving space which can receive therein the foregoingextremely small-sized memory card (a memory card of the second size orIC card) smaller than the RSMMC. The illustrated adapter is one whichfunctions as an adapter especially for HSMMC among RSMMCs. By insertingthe extremely small-sized memory card into the card receiving space ofthe adapter 1L, the adapter becomes employable as an auxiliary storagedevice in any of various portable electronic devices, including theforegoing information processors, image processors and communicationdevices.

Also in this eighth embodiment the thickness size (standardized) of theadapter 1L is different from the standardized size of RSMMC, and theadapter 1L has a first portion which is relatively thin and a secondportion which is relatively thick.

The first portion which is relatively thin has a thickness D1 of, say,1.4 mm which is the same as the thickness size (standardized) of theordinary RSMMC. As in the first embodiment, a terminal region and guiderail regions GR are arranged on a back surface of the adapter 1L. Forexample, thirteen external terminals 2 are arranged in two rows in thetransverse direction of the adapter 1L (in the longitudinal direction ofthe extremely small-sized memory card or in the direction of insertionof the extremely small-sized memory card into the adapter 1L) in anexposed state to the exterior. The guide rail regions GR are the same asin the first embodiment.

On the other hand, in the relatively thick, second portion thicker thanthe first portion, a protuberant portion H is formed on the back surfaceof the adapter 1L. The thickness D2 of the relatively thick, secondportion is the same as in the first embodiment. A planar layout of theprotuberant portion H in the relatively thick, second portion is thesame as in the second embodiment. That is, in the adapter 1L of thiseighth embodiment, the protuberant portion H in the relatively thick,second portion is formed over the rear face of the adapter 1L from aposition spaced a length L3 from the outer periphery of the second row(rear row) of external terminals 2. A planar layout of the protuberantportion H may be such a layout as in the first embodiment. Further, anopening 3 is formed in the rear face of the adapter 1L. The shape andsize of the opening 3 are the same as in the first embodiment.

Next, FIG. 45 is an entire plan view of the upper surface of the adapterafter loading thereto of an extremely small-sized memory card, FIG. 46is an entire plan view of the back surface of the adapter after loadingthereto of the extremely small-sized memory card, FIG. 47 is a sectionalview taken on line X3-X3 in FIG. 45, and FIG. 48 is a plan view of theadapter, showing an example of layout of connector wiring within theadapter. In FIGS. 45, 46 and 48, the memory card present within theadapter 1L is shown in a see-through state. Broken lines in FIGS. 45 and46 each represent the center in the transverse direction of the adapter1L (in the longitudinal direction of the memory card 5 or in thedirection of insertion of the memory card 5 into the adapter 1L).

The configuration of the memory card 5 is the same as in the first toseventh embodiments. In this case, the length in the longitudinaldirection of the memory card 5 is larger than half of the length in thetransverse direction of the adapter 1L. The memory card 5 is insertedwith its rear side ahead into the adapter 1L. The reason is that, in thecase of RSMMC, the length in the direction of insertion of the memorycard 5 is shorter than MMC and that therefore, if the memory card 5 isinserted with its front side ahead into the adapter 1L, the externalterminals 6 of the memory card 5 are positioned in the layout region(terminal region) of the external terminals 2 of the adapter 1L, thusmaking it impossible to arrange therein the internal terminals 10 a ofthe adapter 1L.

The adapter 1L includes a first case (first housing) 8 c on its uppersurface side and a second case (second housing) 8 d on its back surfaceside. The first case 8 c has an upper surface (first surface) and a backsurface (second surface) which are positioned on mutually opposite sidesin the thickness direction of the adapter 1L. The plural externalterminals 2 are arranged on the back surface of the first case 8 c andthe second case 8 d is joined to the back surface of the first case.

In the adapter 1L, the portion of only the first case 8 c is therelatively thin, first portion having the thickness D1, while the joinedportion between the first and second cases 8 c, 8 d is the relativelythick, second portion having the thickness D2. That is, the secondportion 8 d forms the protuberant portion H. Recesses 8 c 1 and 8 d 1formed respectively in the opposed surfaces of the first and secondcases 8 c, 8 d overlap each other to form the card receiving space 9.The card receiving space 9 is positioned centrally in the widthdirection (longitudinal direction) of the adapter 1L. The material andconfiguration of the first and second cases 8 c, 8 d are the same asthose of the first and second cases 8 a, 8 b described above.

The external terminals 2 are electrically connected respectively to oneends of connector lines (wiring lines) 10. Opposite ends of theconnector lines 10 extend into the card receiving space 9 and areelectrically connected to internal terminals 10 a which are formedintegrally at extending ends of the connector lines 10. Theconfiguration of the connector lines 10 and that of the internalterminals 10 a are the same as those described in the first embodiment.Of the plural connector lines 10, predetermined connector lines 10 aredisposed in right and left vacant regions (especially in the relativelythick, second portion) in the width direction (transverse direction) ofthe memory card 5, as shown in FIG. 48, whereby the connector lines 10can be disposed within a thin and small area of the adapter 1L. That is,the thickness of the second portion of the adapter 1L is set to such athickness D2 as covers the sum of both thickness of the memory card 5and height of the connector lines 10, whereby the space for both memorycard 5 and connector lines 10 can be ensured within the adapter 1A.

Ninth Embodiment

FIG. 49 is an entire perspective view of an adapter according to a ninthembodiment of the present invention as seen from an upper surface sideand FIG. 50 is an entire perspective view of the adapter of FIG. 49 asseen from the upper surface side after loading of a memory card thereto.

In this ninth embodiment, as in the fifth embodiment, etc., an opening(second opening) 15 is formed in an upper surface of an adapter 1M forRSMMC so as to extend from the opening 3 toward the card receiving space9. The guide portions 16 described above are formed at upper positionsof both inner side faces of the opening 15. Also in this case, as shownin FIG. 50, When a memory card 5 is inserted into the card receivingspace 9, its upper surface assumes an exposed state to the exterior.Also in this ninth embodiment it is possible to obtain the same effectsas in the fifth embodiment.

Since the memory card 5 is inserted in the reverse direction, thestopper portion described above is not formed on the rear face of thememory card 5. Other constructional points are the same as in the firstto eighth embodiments.

Tenth Embodiment

FIG. 51 is a sectional view of a memory card according to a tenthembodiment of the present invention as cut in parallel with a side facethereof and FIG. 52 is a sectional view of the memory card of FIG. 51 ascut in parallel with a rear face thereof.

A memory card (semiconductor device or IC card) 25A according to thistenth embodiment is employable as an auxiliary storage device in any ofvarious portable electronic devices, including image processors such asdigital cameras and communication devices such as portable telephones.

The memory card 25A is constituted by a small thin plate of arectangular plane shape having a large chamfered portion CA1 for indexat one corner for example. It outline dimensions are, for example, 24 mmin width W1, 32 mm in length L1, and 1.4 mm in thickness D1. The memorycard 25A has the same planar size and function as those of the so-calledfull-size MMC. An upper surface (first surface) of the memory card 25Ais the same as in FIG. 3, while a back surface (second surface) of thememory card 25A is the same as in FIGS. 4 and 22. Length L10 is, say,about 6.5 mm and length L11 is, say, about 24.7 mm.

However, the thickness size (standardized) of the memory card 25A ofthis tenth embodiment is different from the standardized size of MMC andthe memory card 25A includes a first portion which is relatively thinand a second portion which is relatively thick.

In the relatively thin, first portion, a terminal region and guide railregions GR are disposed on the back surface of the memory card 25A. Theexternal terminals 2 described above are disposed in the terminal regionin an exposed state to the exterior. The layout of the externalterminals 2 is the same as in the first to ninth embodiments. The guiderail regions GR are also the same as in the first embodiment. On theother hand, in the relatively thick, second portion which is thickerthan the first portion there is formed a protuberant portion H whichprotrudes slightly in a direction away from the back surface of thememory card 25A. The thickness D2 of the relatively thick, secondportion is set at, say, about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm).

The memory card 25A includes a first case (first housing) 8 e, a secondcase (second housing) 8 f and a memory body 26.

The memory body 26 includes a wiring substrate 27, plural semiconductorchips (hereinafter referred to simply as chips) 28 a mounted on a mainsurface (first surface) of the wiring substrate 27, a sealing portion(first resin sealing body) 29 a which seals the chips 28 a, a chip(electronic part) 28 b mounted on a back surface (second surface) of thewiring substrate 27, and a sealing portion (second resin sealing body)29 b which seals the chip 28 b.

The wiring substrate 27 which constitutes the memory body 26 includesthe main surface (first surface) and the back surface (second surface)which are opposite to each other in the thickness direction of thewiring substrate. The wiring substrate 27 is constituted by, forexample, one or two or more multiple metal wiring layers (wiring lines)disposed within an insulator such as, for example, glass fabric-basedepoxy resin. Wiring lines on the main surface (first surface) of thewiring substrate 27 are electrically connected via through holes to thewiring lines on the back surface (second surface) of the wiringsubstrate 27 and the plural external terminals 2. The external terminals2 are for electric connection between the memory card 25 and theelectronic device, with terminals of the electronic device being broughtinto contact with the external terminals 2.

Flash memory circuits which contribute to the storage of information areformed respectively on the plural chips 28 a provided on the mainsurface of the wiring substrate 27, providing a total memory capacityof, say, 16 M bytes (128M bits), 32 M bytes (256M bits), or 64 M bytes(512M bits). In the illustrated example, the plural chips 28 a formemory are stacked in the thickness direction of the wiring substrate27, whereby a large capacity can be ensured at a small occupied area. Ofcourse, a desired memory capacity may be obtained by arranging theplural chips 28 a for memory on the main surface of the wiring substrate27. The chips 28 a are electrically connected respectively to the wiringlines of the wiring substrate 27 through bonding wires (hereinafterreferred to simply as wires) 30 a and are thereby further connectedelectrically to the chip 28 b and the external terminals 2. For example,the wires 30 a are gold (Au) wires.

The sealing portion 29 a which seals the plural chips 28 a is formedusing a thermosetting resin such as, for example, an orthocresol novolaktype epoxy resin or a biphenyl type epoxy resin and it is one ofprincipal objects thereof to seal the chips 28 a and the wires 30 a in asatisfactory manner. Within the sealing portion 29 a are included pluralfine fillers of quartz glass, e.g., silicon dioxide (SiO₂), harder thanthe resin for improving the mechanical strength, low hygroscopicity andmoldability and for adjusting (lowering) the thermal expansioncoefficient with respect to the sealing portion 29 a for example.Further included in the sealing portion 29 a are an accelerator (acatalyst for accelerating the reaction of the resin), a mold releaseagent, a flame retardant and a colorant. As the colorant there are usedcarbon grains. The first case 8 e is joined over the whole main surfaceof the wiring substrate 27 so as to cover the sealing portion 29 a. Thematerial of the first case 8 e is the same as that of the first case 8a.

On the other hand, a controller circuit for controlling the operation ofthe flash memory circuit of each of the chips 28 a for example is formedin the chip 28 b mounted on the back surface of the wiring substrate 27.The chip 28 b is electrically connected to wiring lines on the wiringsubstrate 27 through wires 30 b and is electrically connected throughthe wiring lines to the chips 28 a for memory and the external terminals2. The wires 30 b are formed of gold (Au) for example. Since the chip 28b is disposed on the back surface of the wiring substrate 27, it ispossible to dispose a large number of chips 28 a for memory on the mainsurface side of the wiring substrate 27. Consequently, the memorycapacity can be increased without changing the planar size of the memorycard 25A.

The chip 28 b may be substituted, for example, by a dielectric antenna,a ferrite part for Blue Tooth, or a chip part (electronic part) having apassive element such as coil, capacitor or resistor (e.g., pull-upresistor). In this case, the passive element can be disposed closer tothe flash memory circuit and control circuit and hence it is possible toimprove electrical characteristics of the memory card 25A.

The sealing portion 29 b which seals the chip 28 b is formed of the samematerial as that of the sealing portion 29 a and it is one of mainobjects thereof to seal the chip 28 b and the wires 30 b in asatisfactory manner. The case 8 f is joined to the back surface of thewiring substrate 27 at a position spaced a length L3 from the second row(rear row) of external terminals 2 of the memory card 29 b so as tocover the sealing portion 29 b. The protuberant portion H is formed bythe second case 8 f. The reason why the spacing from the second row ofexternal terminals 2 is set at L3 is the same as that set forth in thefirst embodiment. The material of the second case 8 f is the same asthat of the first case 8 a.

Eleventh Embodiment

FIG. 53 is a sectional view of a memory card according to an eleventhembodiment of the present invention as cut in parallel with a side facethereof and FIG. 54 is a sectional view of the memory card of FIG. 53 ascut in parallel with a rear face thereof.

In a memory card 25B of this eleventh embodiment, the second case 8 fdescribed above is not joined to a back surface of the memory card 25Band a sealing portion 29 b is exposed to the exterior. In this case, aprotuberant portion H corresponds to only the thickness of the sealingportion 29 b, so that the thickness D2 of the second portion can be madesmaller than in the case of the memory card 25A of the tenth embodiment.Since the sealing portion 29 b is exposed, there is a fear thatconstituent portions such as terminals and guide rails of the electronicdevice may be damaged or deteriorated by for example fillers containedin the sealing portion 29 b. In this case, it is preferable to make theamount of fillers contained in the sealing portion 29 b smaller thanthat contained in the main surface-side sealing portion 29 a or usefillers smaller in particle diameter than the fillers contained in thesealing portion 29 a. Other constructional points are the same as in thetenth embodiment.

Twelfth Embodiment

FIG. 55 is a sectional view of a memory card according to a twelfthembodiment of the present invention as cut in parallel with a side facethereof and FIG. 56 is an enlarged sectional view of a principal part ofa second portion on a back surface side of the memory card of FIG. 55.

A memory card (semiconductor device or IC card) according to thistwelfth embodiment has the same planar size and function as those of theso-called RSMMC, e.g., 24 mm in width W1 and 18 mm in length L5. Anupper surface (first surface) of the memory card 25C is the same as inFIG. 40 and a back surface (second surface) thereof is the same as inFIG. 41. Length L12 is, say, about 10.6 mm.

Also in the case of the memory card 25C of this embodiment, itsthickness size (standardized) is different from the standard of RSMMCand the memory card 25C includes a first portion which is relativelythin and a second portion which is relatively thick. The relativelythin, first portion has a thickness D1 equal to the thickness size(standardized) of the ordinary RSMMC, e.g., 1.4 mm.

In the relatively thin, first portion, a terminal region and guide railregions GR are disposed on the back surface of the memory card 25C. Asin the first to eleventh embodiments, external terminals are arranged inthe terminal region in an exposed state to the exterior. The guide railregions GR are also the same as in the first embodiment. On the otherhand, in the relatively thick, second region which is thicker than thefirst region there is formed a protuberant portion H which slightlyprotrudes in a direction away from the back surface of the memory card25C. The relatively thick, second portion has a thickness D2 of, say,about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm).

The memory card 25C includes a first case (first housing) 8 g, a secondcase (second housing) 8 h, and a memory body 26.

The memory body 26 includes a wiring substrate 27, plural chips 28 a, 28b mounted on a main surface (first surface) of the wiring substrate 27,a sealing portion (first resin sealing body) 29 a for sealing the chips28 a and 28 b, a passive element (electronic part) 31 mounted on a backsurface (second surface) of the wiring substrate 27, and a sealingportion (second resin sealing body) 29 b for sealing the passive element31. The wiring substrate 27, chips 28 a, 28 b and sealing bodies 29 a,29 b are the same as in the tenth and eleventh embodiments.

It is one of principal objects of the sealing portion 29 b to seal thepassive element 31 in a satisfactory manner. Also in the memory card25C, the second case 8 h described above is jointed to the back surfaceof the wiring substrate 27 so as to cover the sealing portion 29 b at aposition spaced a distance L3 from the second row (rear row) of externalterminals 2 of the memory card. The protuberant portion H is formed bythe second case 8 h. The reason why the spacing is set at the length L3is the same as that set forth in the first embodiment. The material ofthe first and second cases 8 g, 8 h is the same as that of the firstcase 8 a described above.

In the illustrated example, a pull-up resistor is shown as the passiveelement 31 which resistor is connected in series with an externalterminal 2 for signal to prevent the occurrence of ringing waveform of ahigh-speed signal. The passive element 31 includes electrodes 31 aspaced apart a desired distance from each other and carbon paste 31 bwhich is deposited so as to bridge the electrodes 31 a. The electrodes31 a are formed, for example, by plating the surface of a copper (Cu)body with silver (Ag) and are connected electrically to the aforesaidexternal terminal 2 and chips 28 a, 28 b through wiring lines of thewiring substrate 27. A resistor (pull-up resistor) is formed by thecarbon paste 31 b present between the adjacent electrodes 31 a. Forexample, a printing method is used to form such a pull-up resistor.Thickness D1 is, say, about 100 μm.

When the pull-up resistor is formed within a chip, there occurvariations in resistance value due to a heat treatment which isperformed during fabrication of the chip, and thus it is impossible toform within a chip a pull-up resistor for which a high accuracy isrequired. On the other hand, if the pull-up resistor is disposed on theelectronic device side, it may be impossible to obtain satisfactoryelectrical characteristics because of a too long distance between memorycircuit and control circuit. In this twelfth embodiment, it is possibleto improve the resistance value setting accuracy in comparison with thecase where the resistor is formed within a chip. Moreover, since thepassive element 31 for the pull-up resistor is provided on the backsurface of the memory card 25C, it is possible to shorten the distancefrom the passive element 31 to the chips 28 a for memory and the chip 28b for control. As a result, it is possible to improve the electricalcharacteristics of the memory card 25C. The pull-up resistor may besubstituted by, for example, a dielectric antenna, a ferrite part forBlue Tooth, or another passive element 31 having a thickness fallingunder the range of the thickness D2 such as a coil or a capacitor.

Thirteenth Embodiment

FIG. 57 is a sectional view of a memory card according to thirteenthembodiment of the present invention as cut in parallel with a side facethereof.

In a memory card 25D of this thirteenth embodiment, the second case 8 hdescribed above is not joined to a back surface of the memory card 25D,but a sealing portion 29 b is exposed to the exterior. In this case, aprotuberant portion H corresponds to only the thickness of the sealingportion 29 b and therefore it is possible to make the thickness of thesecond portion D2 smaller than in the memory card 25C of the twelfthembodiment. Since the sealing portion 29 b is exposed, there is a fearof damage or deterioration of terminals of the electronic device or suchcomponents as guide rails by for example fillers contained in thesealing portion 29 b. In this case, it is preferable to make the amountof fillers contained in the sealing portion 29 b smaller than that offillers contained in the main surface-side sealing portion 29 a or usefillers smaller in particle size than the fillers contained in thesealing portion 29 a. Other constructional points are the same as in thetwelfth embodiment.

Although the present invention has been described above concretely byway of embodiments thereof, it goes without saying that the invention isnot limited to the above embodiments, but that various changes may bemade within the scope not departing from the gist of the invention.

For example, although in the tenth to thirteenth embodiments each chipand the wiring substrates are electrically connected with each otherthrough wires, no limitation is made thereto. The chip and the wiringsubstrates may be electrically connected with each other through bumpelectrodes. In this case, the chip is mounted on the wiring substratethrough bump electrodes in a state in which its main surface is opposedto the main surface of the wiring substrate. Components on the mainsurface of the chip are connected to wiring lines of the wiringsubstrate through bump electrodes and are further connected electricallyto external terminals.

Although the present invention has been described above mainly about thecase where it is applied to a portable computer, a digital camera or aportable telephone as a background application field thereof, nolimitation is made thereto. The present invention is applicable also toother mobile information processors such as, for example, PDA (PersonalDigital Assistants).

INDUSTRIAL APPLICABILITY

The present invention is applicable to the manufacturing industry ofmemory card adapters and memory cards.

1-15. (canceled)
 16. A memory card comprising: a wiring substrate havinga first surface and a second surface which are disposed on mutuallyopposite sides in the thickness direction of the wiring substrate; asemiconductor chip mounted on the first surface of the wiring substrateand having a memory circuit which contributes to the storage ofinformation; a first resin sealing body for sealing the semiconductorchip; a first housing provided on the first surface side of the wiringsubstrate so as to cover the first surface of the wiring substrate andalso cover the first resin body; an electronic part mounted on thesecond surface of the wiring substrate; a second resin sealing body forsealing the electronic part; a plurality of external terminals formed onthe second surface side of the wiring substrate at a position spacedaway from the second resin sealing body and connected electrically tothe semiconductor chip and the electronic part; and a second housingprovided on the second surface of the wiring substrate so as to coverthe second resin sealing body at a position spaced away from the areawhere the plurality of the external terminals are disposed to let theexternal terminals be exposed to the exterior, wherein the thickness ofthe memory card portion where the second housing is provided is largerthan the thickness of the memory card portion where the plurality of theexternal terminals are disposed.
 17. A memory card according to claim16, wherein the plurality of the external terminals are disposed in tworows in a direction of insertion of the memory card into an electronicdevice.
 18. A memory card according to claim 16, wherein the electronicpart is a semiconductor chip, the semiconductor chip having a controlcircuit for controlling the operation of the semiconductor chip havingthe memory circuit which contributes to the storage of information. 19.A memory card according to claim 16, wherein the electronic part is apassive element.
 20. A memory card according to claim 19, wherein thepassive element is a pull-up resistor.
 21. A memory card comprising: awiring substrate having a first surface and a second surface which aredisposed on mutually opposite sides in the thickness direction of thewiring substrate; a semiconductor chip mounted on the first surface ofthe wiring substrate and having a memory circuit which contributes tothe storage of information; a first resin sealing body for sealing thesemiconductor chip; a first housing provided on the first surface sideof the wiring substrate so as to cover the first surface of the wiringsubstrate and also cover the first resin sealing body; an electronicpart mounted on the second surface of the wiring substrate; a secondresin sealing body for sealing the electronic part, the second resinsealing body being formed in an exposed state to the exterior; and aplurality of external terminals formed on the second surface side of thewiring substrate at a position spaced away from the second resin sealingbody and connected electrically to the semiconductor chip and theelectronic part, wherein the thickness of the memory card portion wherethe second resin sealing body is provided is larger than the thicknessof the memory card portion where the plurality of the external terminalsare disposed.
 22. A memory card according to claim 21, wherein theplurality of the external terminals are disposed in two rows in adirection of insertion of the memory card into an electronic device.